High Temperature Effusion Cell-HTEZ

The HTEZ is designed for evaporation or sublimation of low vapor pressure elements and compounds at temperatures

up to 1900°C, e.g. for materials like Fe, Cr, Ni, Co, Au, Ge, etc. Typical applications are surface science analysis or thin film deposition of magnetic topological insulation or oxide layers.

Features:

Mounting flange: DN40CF (O.D. 2.75“) or DN63CF (O.D. 4.5“)

Filament type: self-supporting tungsten filament

Thermocouple: W5%Re/W26%Re (type C)

Bakeout temperature: max. 250°C

Outgassing temperature: max. 1900°C, depending on crucible material

Operation temperature: max. 1900°C, depending on crucible material and filament design

Cooling: integrated water cooling [K] or separate cooling shroud

Shutter: integrated rotary shutter (S) with Ta shutter plate

Crucibles: 1.5, 10, or 35 cm³; Al₂O₃, BeO, Ta, W crucibles (other materials on request)

Options : integrated water cooling (K), integrated rotary shutter (S)