Oxygen Resistant Effusion Cell-OREZ

A steadily increasing number of applications requires robust, reactive gas resistant equipment for material deposition, often employed in combined UHV and reactive gas process steps carried out in one vacuum system.

OREZ cells are therefore designed to operate in a pressure range from UHV up to nearly atmospheric pressure. Best performance is achieved in a pressure range from 10^-6 to 10^-3 mbar.

Typical applications are the formation of oxide layers by surface oxidation, growth of oxide films by evaporation of metals in oxygen atmosphere, and direct evaporation of oxides. Surface oxide layers and thin films are widely used as insulator materials, e.g. in microelectronic devices. Thick oxide films are often used in sensors and optical devices, due to the multifaceted optical, magnetic, electrical and semiconductive properties of oxides.

Features:

Filament type: Ni alloy or noble metal alloy

wire heating filament: standard (SF), hot lip (HL), cold lip (CL), dual (DF)

Thermocouple: NiCr/NiAl (type K)

Operating temperature: 200-1200°C (depending on filament material and operation conditions)

Outgassing temperature: 1000 / 1200°C (depending on filament material)

Bakeout temperature: 250°C

Cooling: integrated water cooling or separate cooling shroud

Crucibles: 10-125 cc; PBN, Al₂O₃, BeO crucibles (other materials on request)

Options: integrated water cooling (K), integrated rotary shutter (S)